Semiconductor Packaging News
TSMC and Nvidia Team Op on Silicon Photonics, CEO Jensen Huang Says Nvidia and TSMC have teamed up to advance silicon photonics, a promising low-power technology for optical transmission.
Semiconductor Packaging News
In 2025, the semiconductor market is set for growth, with analysts projecting a 20% increase as demand rebounds from recent declines. Despite geopolitical and economic uncertainties, the long-term outlook remains positive across key sectors, driven by demand from emerging markets within the Internet of Things (IoT) framework. ...
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News Index
SIA Applauds CHIPS Act Incentives for Infinera, Corning, Edwards Vacuum, and GlobalFoundries The Semiconductor Industry Association praised recent CHIPS Act agreements supporting semiconductor projects in California, Pennsylvania & New York.
Semiconductor Packaging News
U.S. launches new probe into legacy Chinese chips as tech pressure on Beijing escalates The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks.
Innovations Driving The Advanced Packaging Roadmap: Part One
Jan 15, 2025 · Advancements in IC substrates are driving toward 2µm L/S technology, but organic substrates face deformation and defects. Innovations like photoresists show promise, yet glass substrates stand out as the key to sub-1.5µm breakthroughs ...
2025: So Many Possibilities
Jan 17, 2025 · The semiconductor industry gears up for a groundbreaking 2025, fueled by rising compute demands, AI advancements & new architectures. Innovations like silicon photonics, chiplets & quantum computing promise to redefine design, power efficiency & data center infrastructures ...
Semiconductor Packaging News Technical Paper Index
Dec 24, 2024 Package Integrated Vapor Chamber Heat Spreaders Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders.
Semiconductor Packaging Press Release Index
Jan 14, 2025 SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth Industry Strategy Symposium (ISS) 2025 sessions open today gathering semiconductor industry executives for analysis of growth projections and pivotal business trends ...
Advanced Packaging the Next Big Thing in Semiconductors
Advanced Packaging the Next Big Thing in Semiconductors: Summary Semiconductor innovation advances with the rise of advanced packaging techniques, promising enhanced performance and efficiency in electronic devices.